Dr. George Alexandru Boldeiu | Pressure Sensor | Best Researcher Award

Dr. George Alexandru Boldeiu, IMT Bucharest, Romania

George Alexandru Boldeiu is a Romanian researcher specializing in microtechnology, MEMS devices, and thermal-electromagnetic simulations. He is currently an IDT II at the Micromachined Structures, Microwave Circuits, and Devices Laboratory at the National Institute for Research and Development for Microtechnologies in Bucharest. With extensive experience in thermal, mechanical, and electromagnetic simulations using Ansys and COMSOL, his work focuses on surface acoustic wave (SAW) devices, temperature and magnetic sensors, and microwave characterization. Prior to this, he worked as a thermal simulation engineer at Continental Automotive Romania, where he contributed to thermal modeling and optimization of electronic components. He holds a Bachelor’s degree in Mathematical Engineering from the University Politehnica of Bucharest and a Bachelor’s degree in Physics from the University of Bucharest. Currently, he is pursuing a Ph.D. at the Doctoral School of Electronics, Telecommunications & Information Technology at the University Politehnica of Bucharest. His research interests span classical mechanics, quantum mechanics, solid-state physics, and electromagnetism, with expertise in CAD/CAE tools such as Ansys, COMSOL, and SolidWorks.

Professional Profile:

GOOGLE SCHOLAR

Summary of Suitability for Best Researcher Award

George Alexandru Boldeiu has a solid research background spanning over two decades in microtechnology, MEMS (Micro-Electro-Mechanical Systems), and electromagnetic simulations. His experience includes working at the National Institute for Research and Development for Microtechnologies in Bucharest and Continental Automotive Romania, where he conducted advanced simulations in thermal, mechanical, and electromagnetic domains.

🎓 Education

📍 PhD Student (2020 – Present)
Doctoral School of Electronics, Telecommunications & Information Technology, University Politehnica of Bucharest

📍 Bachelor of Physics (2011 – 2014)
Faculty of Physics, University of Bucharest, Bucharest

📍 Bachelor of Mathematical Engineering (1996 – 2001)
Faculty of Electrical Engineering, University Politehnica of Bucharest

💼 Work Experience

🔬 IDT II (2019 – Present)
Micromachined Structures, Microwave Circuits and Devices Laboratory, National Institute for Research and Development for Microtechnologies, Bucharest

🔥 Thermal, mechanical, and electromagnetic simulation using Ansys & COMSOL
📡 Simulation of MEMS and acoustic wave-based devices
⚡ Electromagnetic field simulation (low & high frequency)
🎨 3D printing design & electric measurements
🌡️ SAW devices on III-nitride layers, microwave characterization, and SAW sensors

💻 Thermal Simulation Engineer (2017 – 2019)
Continental Automotive Romania (ADAS)

🔥 Thermal modeling using Ansys & Icepak
🏗️ Coupled thermal-structural and thermal-electric analysis
💡 Worked on cooling solutions with mechanical and system engineers

🖥️ Engineer (2007 – 2017)
Simulation, Modelling & Computer-Aided Design Laboratory, National Institute for Research and Development for Microtechnologies, Bucharest

🎯 Thermal, mechanical, and electromagnetic simulation
🛠️ MEMS device simulations & 3D printing design
⚡ Electromagnetic field analysis

🗄️ Database Administrator (2004 – 2007)
Internet/Intranet Laboratory, National Institute for Research and Development for Microtechnologies, Bucharest

🔬 Junior Researcher (2001 – 2004)
Nano-Scale Structuring and Characterization, National Institute for Research and Development for Microtechnologies, Bucharest

🏆 Achievements & Honors

📡 Significant contributions to SAW devices and MEMS simulation research
🔍 Expertise in coupled multiphysics simulations (thermal-electrical-structural)
🏅 Extensive experience in CAD/CAE tools for advanced modeling
🛠️ Development of rapid-prototyping designs for research applications

Publication Top Notes:

GaN membrane supported SAW pressure sensors with embedded temperature sensing capability

CITED:47

The behavior of gold metallized AlN/Si-and AlN/glass-based SAW structures as temperature sensors

CITED:23

Applications of electrostatic capacitance and charging

CITED:20

Investigation of temperature sensing capabilities of GaN/SiC and GaN/sapphire surface acoustic wave devices

CITED:16

Characterization and modeling of quantum dot behavior in FDSOI devices

CITED:15

Mr. Yi Sun, Dalian Jiaotong University, China

Yi Sun is a Master of Science student in Mechanical Engineering, currently participating in a joint training program between Tsinghua University and Dalian Jiaotong University. His research focuses on the conversion relationships between thermal, mechanical, and electrical energy at the nanoscale. Yi has conducted dynamic response observations of thin-film thermocouples and developed mathematical models for heat transfer, leading to publications as the first author in notable journals. His work includes significant projects at the Provincial Key Laboratory of Modern Sensors and Actuators and the State Key Laboratory of Tribology, where he explores advanced topics such as thin-film thermocouple performance and tribological behavior in specialized atmospheres. Yi’s contributions are marked by his strong analytical skills and innovative approach to sensor technology and thermal dynamics.

Education:

Tsinghua University & Dalian Jiaotong University (M.E., 2022 – Present) 🎓

Dalian Jiaotong University (B.E., 2018 – 2022) 🎓

Research Interests:

Yi is passionate about nanoscale energy conversions and has conducted advanced research on thin-film thermocouples, contributing valuable insights into dynamic calibration and heat transfer. 🔍⚙️

Work Experience:

Provincial Key Laboratory of Modern Sensors and Actuators, Dalian Jiaotong University
Position: Researcher
Duration: June 2023 – January 2024
Responsibilities:
- Studied the mechanism of large creep adhesion in wheel-rail braking at 400 km/h.
- Contributed to the National Natural Science Foundation of China (NNSFC) projects on the effect of multi-component doped solid solution alloy on thin-film thermocouple performance and the design of transparent conductive oxide molecular-like structural units.
State Key Laboratory of Tribology, Tsinghua University
Position: Researcher
Duration: January 2024 – Present
Responsibilities:
- Conducting research on the tribological behavior of foil bearings in non-oxidizing atmospheres.
Dalian Jiaotong University
Position: Master’s Student Researcher
Duration: 2018 – 2022
Responsibilities:
- Developed mathematical models for heat transfer and observed dynamic responses of thin-film thermocouples on the nanoscale and nanosecond scale.
- Published a research paper as the first author on thermoelectric electromotive force oscillation of thin-film thermocouples.